Recently Viewed Items

Clear this list

Epoxy Encapsulating and Potting Compound

Epoxy Encapsulating and Potting Compound Black

Description of Epoxy Encapsulating and Potting Compound

Scroll to Pricing

To protect your important electrical appliances and devices from impact, heat, shock, moisture, chemicals and more, there is one product that will do the trick: Epoxy Encapsulating and Potting Compound from MG Chemicals. This epoxy is non-conductive and is easy to make. Mix, pour, and in an hour the solution is already working. Once it cures, MGC 832 Epoxy is stuck nearly forever; great for potting your electronics and keeping them well hidden and guarded.

By using the black epoxy, you can basically create a film over your printed circuit board (PCB) that shields it from curious eyes, and protects it from outside forces. Made of a form of nylon, the 832B and 832C Epoxies are highly impact resistant and fitting for explosion proof components. The black Epoxy is one option; if you only wish to protect your electronics and not cover them in color, you can choose the clear version of MG Chemicals Epoxy Encapsulating and Potting Compound.

Please click the "More Information" tab for dimensions and specifications.

Review this item After receiving your order add a new product review here and receive 10% Off on your next order!!

Features and Benefits

  • Protects electrical components
  • 2:1 mixing ratio
  • Low toxicity
  • Impact resistant
  • RoHS Compliant
  • One Year Standard Warranty

More Info

 Curing & Work Schedule
 Working Life 60min 
 Shelf life >3 year
 Full Cure at 20C [68F] 24hr 
  at 65C [149F]60min 
  at 80C [176F] 45min 
  at 100C [212F]35min 
 Storage Temp of Unmixed Parts 16 to 27C [69-80F] 
 Curing & Work Schedule
 Constant Service Temp -30C to 140C [-22 to 284F]
 Service Temperature <-30 | + 145C [<-22 | + 294F] 
 Cured Properties - PhysicalTest Method
 ColorVisual Black 
 Density (at 26C)ASTM-D-792 1.12 g/cm 
 Hardness(Shore D durometer) 80D to 82D 
 Tensile StrengthASTM-D-638 56.9N/mm [8,250lb/in] 
 ElongationASTM-D-638 3.3% 
 Lap Shear StrengthASTM-D-1002 4.2N/mm [606lb/in] 
 Izod ImpactASTM-D-256 0.932kJ/m [0.443ftlb/in] 
 Compression StrengthASTM-D-695 155N/mm [22,400lb/in] 
                                 ModuluASTM-D-6952,590N/mm [375,000lb/in] 
Flexural StrengthASTM-D-790113.76N/mm [16,500lb/in]
                                 ModuluASTM-D-7902,940 N/mm [427,000lb/in]
 Cured Properties - ElectricalTest Method
 Breakdown VoltageASTM-D-149 51.9kV @ avg of 2.79mm 
 Dielectric StrengthASTM-D-149 472V/mil [186.kV/mm] 
 Volume ResistivityASTM-D-257 5.3x10^12 ohmcm 
 Surface ResistivityASTM-D-257 3.1x10^10 ohm 
 Comparative Tracking IndexASTM-D-3628 Not established 
 Dielectric Dissipation & ConstantASTM-D-150 to 98 Dissipation, D constant, k'
 @60Hz 0.007 D, 3.90 k' 
 @1 kHz 0.008 D, 2.95 k' 
 @10kHz 0.013 D, 2.89 k' 
 @100kHz 0.018 D, 2.83 k' 
 @1 MHz 0.017 D, 2.77 k' 
 Cured Properties - ThermalTest Method
 Coefficient of Thermal Expansion (CTE)ASTM-E-831 104ppm/C 
Glass transition Temperature (Tg) ASTM-D-3418 Not established 
 Heat Deflection Temperature (HDT)ASTM-D-648 46.638C [115.95F] 
 Uncured Properties - PhysicalPart APart B
 ColorBlack Clear, Amber Tint 
 Viscosity at 24C [73F]2,500cP (2.5Pas] 11,000cP [11.0Pas] 
 Density1.127g/mL 0.967g/mL 
 Flash Point154C [309F] 110C [230F] 
Uncured Properties - PhysicalMixture (2A:1B)
 Viscosity at 20C [73F]3,300cP [3.3 Pas] 
 Mix Ratio by volume (A:B)2.0:1.0  
 Mix Ratio by weight (A:B)2.3:1.0  
 Solids of Content (w/w)99%  
 Chemical Solvent Resistance
 Weight Change 3 daysWeight Change 45 days
 Water<0%                    <1% 
 Hydrocloric Acid<0%<1% 
 Isopropyl Alcohol0.3% <1% 
 Mineral Spirits0.3% 0.3% 
 Xylene2% 9% 
 Ethyl Lactate5% 8% 
 Acetone7% Destroyed 

Sample Size (grams)Peak Exotherm (Temp in 0C)Time in Minutes

Available Sizes
Catalog NumberSizes AvailableDescription
832B-375ML375ml (12oz)Liquid
832B-3L3L (0.8gal)Liquid
832B-12L12L (3.2gal)Liquid
832B-60L60L (16gal)Liquid


Payment methods
Secure server