Recently Viewed Items

Clear this list

Newsletter

MG Chemicals High Temperature Epoxy Encapsulating and Potting Compound


MG Chemicals High Temperature Epoxy Encapsulating and Potting Compound

Description of MG Chemicals High Temperature Epoxy Encapsulating and Potting Compound

Scroll to Pricing

Need to protect your electronic equipment but wary of the harmful materials you may come into contact with? MG Chemicals High Temperature Epoxy Encapsulating and Potting Compound is an efficient sealant thats safe to use and RoHS compliant. This high temperature epoxy can bond to a variety of materials in hot environments and is easy to mix. A 1 to 1 mixture of each bottle and in minutes it's ready.

Apply the solution to your devices; theyll be protected from moisture, impact, and shock as well as the harsher elements. They can be submerged in salt water, acids, bases, fuels, and alcohols and theyll still work fine. High temperature epoxy encapsulates electronics, keeping them safe from physical abuse, chemical damage, and can withstand temperatures up to 527F (275C). Extremely difficult to remove, your accessories will be secure for a long time.

Please click the "More Information" tab for dimensions and specifications.


Review this item After receiving your order add a new product review here and receive 10% Off on your next order!!

Features and Benefits

  • Protects electrical components
  • Impact resistant
  • High temperature protection up to 527F (275C)
  • RoHS Compliant

More Info

 Cured Properties - PhysicalTest MethodResult
 Part A
 Viscosity at 23F (73F) 54,800cps 
 Specific Gravity @ 23C 1.23g/L 
 Part B
 Viscosity at 23C (73F) 11,000cps 
 Specific Gravity @ 23C 0.98g/L 
 Mixed
 Viscosity at 23C (73F) 40,000cps 
 Specific Gravity @ 23C 1.12g/L 
 Mixing Ratio by Volume 2.0:1.0 (Part A: Part B) 
 Mixing Ratio by Mass 2.186:1.000 
 Maximum Service Temperature 275C (527F) 
 Color Black 
 Maximum Intermittent Temperature 300C (572F)
 Working Time (100g sample) 1 hr 
 Hardness, Shore D 80 
 Tensile StrengthASTM-D-638-02a 7,861 PSI 
 ElongationASTM-D-638-02a 3.38% 
 Compressive StrengthASTM-D-695-02a 11,870 PSI 
 Flexural StrengthASTM-D-790-03 14,600 PSI 
 Flexural ModulusASTM-D-790-03 399,000 PSI 
 Lap Shear StrengthASTM-D-1002-01 1,794 PSI 
 Coefficient to Thermal ExpansionASTM-D-648-01  
 -40C to 50C 75.7x10^-6mm/mmC 
 +100C to +250C 154.0x10^-6mm/mmC 
 -40C to +250C 125.3x10^-6mm/mmC 
 +25C tp +250C 140.2x10^-6mm/mmC 
 Deflection Temperature Under LoadASTM-D-648-01  53.9C (129.02F)
Thermal ConductivityASTM-E-1530-990.210 W/mK
 Thermal Conductivity @ 25C (77F)ASTM-E-1461-92 in W/mK (BTU in (hr ft F)) 0.218 (1.51)
 Thermal Diffusivity @ 25C (77F)ASTM-E-1461-92 1.33 x 10^-13 M/s
 Specific Heat Capacity @ 25C (77C)ASTM-E-1269-01  1419 J/kgK
 Curing Time (100g)
 @ room temp 24hrs 
 @65C 60min 
 @80C 45min 
 @100C 35min 
 @130C  25min
 @160C 15min 
 @200C 10min 
 Cured Properties-ElectricalTest Method Result 
 Corrected Dissipation Factor, DASTM-D150-98 0.007 @ 1KHz 


0.011 @ 10KHz


0.014 @ 100KHz


0.014 @ 1MKHz
 Dielectric ConstantASTM-D150-98 4.24 @ 60Hz


2.96 @ 1KHz


2.81 @ 10KHz


2.83 @ 100KHz


2.83 @ 1MKHz
 Dissipation FactorASTM-D-150-98 0.0017 @ 60Hz 
 Volume ResistivityASTM-D-257-99 9.3x10^15 ohmcm 
 Surface ResistivtyASTM-D-257-99 5.3x10^13 ohm 
 Dielectric StrengthASTM-D149-97a 1,138 V/mil @ 0.020" 
 Breakdown VoltageASTM-D149-97a 54.4 KV 


Sample Size (grams)Peak Exotherm (Temp in 0C)Time in Minutes
5044155
10063110
50011065

Available Sizes
Catalog NumberSizes AvailableDescription
832HT-375ML375ml (12oz)Liquid
832HT-3L3L (0.8gal)Liquid

Pricing


Quantity
Payment methods
Secure server