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MGC Lead-Free Solder with Silver


MGC Lead-Free Solder with Silver

Description of MGC Lead-Free Solder with Silver

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Its not that hard when looking for safe-to-use solder, and it doesnt get any better with MG Chemicals Lead-Free Solder. Made of Tin, Copper, and Silver, this solder is pure and simple, not to mention powerful. The addition of silver makes for a greater level of conductivity and electrical current-carrying capacity. Not only does lead-free solder with silver pack a punch, but it also contains no-clean flux, which means less residue to clean up after work.

You can use solder for many electrical applications, such as designing circuit boards and fixing spliced wires. The flux is easy to wet, spread, and is nearly splatter-free leaving virtually no mess. Available in a diameter of 21 AWG, most jobs are covered by this solder with silver. Order up to a single pound of lead-free spool, and get 27% more length than you would find in a leaded spool.

Please click the "More Information" tab for dimensions and specifications.


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Features and Benefits

  • Lead-Free
  • No-clean Flux
  • J-STD-006 Compliant
  • RoHS Compliant

More Info


 Test MethodSpecification
 Ag content 2.3-3.2% 
 Cu content 0.3-0.7% 
 Sn content Balance 
 Flux ClassificationJTSD-004 REL0 
 Copper MirrorIPC-TM-650 2.3.32 No removal of copper film 
 Silver ChromateIPC-TM-650 2.3.33 Pass 
 CorrosionIPC-TM-650 2.6.15 Pass 
 SIR JSTD-004, Pattern DownIPC-TM-650 2.6.3.3 2.33x10^11ohms 
 SIR Bellcore (Telecordia)Bellcore GR-78-CORE 13.1.3 6.12x10^11ohms 
 ElectromigrationBellcore GR-78-CORE 13.1.4 Pass 
 Post Reflow Flux ResidueTGA Analysis 55% 
 Acid ValueIPC-TM-650 2.3.13 190-210 
 Flux Residue DrynessIPC-TM-650 2.4.47 Pass 
 Spitting of Flux-Cored SolderIPC-TM-650 2.4.48 0.3% 
 Solder SpreadIPC-TM-650 2.4.46 130mm 
 Lead free/leaded solder comparisonLead Free Solder (Sn/Ag/Cu)Sn63/Pb37 (Leaded Solder)
 Melting Point217-221C (422.6-429.8F) 183C (361.4F) 
 Wire Diameter0.032"(0.81mm) 0.032"(0.81mm) 
 Std.Wire Gauge21 21 
 Tolerance, in.+/- 0.002" +/- 0.002" 
 Hardness, Brinell15HB 14HB 
 Coefficient of Thermal ExpansionPure Sn=23.5 24.7 
 Tensile Strength4312psi 4442psi 
 Density7.39g/cc 8.42g/cc 
 Electrical Resistivity13.0uohm-cm 14.5uohm-cm 
 Electrical Conductivity16.6%IACS 11.9%IACS 
 Yield Strength. psi3724 3950 
 Total Elongation, %27 48 
 Creep Strength, N/mm at 0.1mm/min 20C13.0 3.3 
 Creep Strength, N/mm at 0.1mm/min 100C
 Thermal Conductivity58.7 W/m*K 50.9 W/m*K 
 Joint Shear Strength, at 0.1mm/min 20C17 14 

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